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Solid phase epitaxial re-growth of Sn ion implanted germanium thin films

机译:锡离子注入锗薄膜的固相外延生长

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摘要

Doping of Ge with Sn atoms by ion implantation and annealing by solid phase epitaxial re-growth process was investigated as a possible way to create GeSn layers. Ion implantation was carried out at liquid nitrogen to avoid nano-void formation and three implant doses were tested: 5×10, 1×10 and 5×10 at/cm, respectively. Implant energy was set to 45 keV and implants were carried out through an 11 nm SiNO film to prevent Sn out-diffusion upon annealing. This was only partially effective. Samples were then annealed in inert atmosphere either at 350°C varying anneal time or for 100 s varying temperature from 300 to 500°C. SPER was effective to anneal damage without Sn diffusion at 350° for samples implanted at medium and low fluences whereas the 5×10 at/cm samples remained with a ∼15 nm amorphous layer even when applying the highest thermal budget. © 2012 American Institute of Physics.
机译:研究了通过离子注入和固相外延再生长退火对锗进行Sn掺杂的方法,作为一种可能的形成GeSn层的方法。在液氮下进行离子注入以避免形成纳米空洞,并测试了三种注入剂量:分别为5×10、1×10和5×10 at / cm。将注入能量设定为45keV,并通过11nm的SiNO膜进行注入以防止Sn在退火时向外扩散。这只是部分有效。然后将样品在惰性气氛中以350摄氏度的退火时间或300到500摄氏度的温度变化100 s进行退火。对于中,低通量注入的样品,SPER可以有效地退火,而在350°时没有锡扩散,而5×10 at / cm的样品即使采用最高的热收支,仍具有约15 nm的非晶层。 ©2012美国物理研究所。

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